Iittala Scales the Aalto Vase to Seven Meters for 3daysofdesign
Marking 90 years of an iconic design, the immersive walk-in structure brings the iconic silhouette to architectural scale.
Summary
- Iittala is set to debut a seven-meter architectural pavilion at Copenhagen’s 3daysofdesign
- Built from low-carbon Hydro aluminum, the structure replicates Alvar Aalto’s iconic vase
- The walk-in landmark houses the new Aalto City Vase collection, inspired by six global cities
At the upcoming 3daysofdesign in Copenhagen, Iittala will unveil the Aalto 90 Pavilion, a seven‑meter‑high installation that transforms Alvar Aalto’s iconic vase into an immersive architectural experience. Set on the harbourfront at Ofelia Plads, the pavilion invites visitors to step inside one of modern design’s most recognizable silhouettes, reimagined at monumental scale.
Designed by TABLEAU CPH and realized in low‑carbon aluminium from Hydro, the structure embodies Nordic design heritage, material innovation and contemporary architectural experimentation. The pavilion is built in collaboration with aluminum company Hydro and is constructed using low-carbon aluminum profiles extruded entirely with 100% renewable energy. The aluminum is cut into two precise lengths and clamped together, allowing the vase’s soft, organic curves to be rendered at an architectural scale with a weightless visual presence. Engineered with circularity in mind, the modular system is designed to be fully dismantled, recycled, or transported to future global destinations.
At the heart of the pavilion, Iittala introduced the Aalto City Vase collection, a series inspired by six global cities: Berlin, Amsterdam, Tokyo, New York, Helsinki and Copenhagen. Each vase reinterprets Aalto’s fluid form through distinct colors and atmospheres, creating a dialogue between object and space. The pavilion thus becomes both a stage and a vessel, expanding the vase into architecture and returning it to a collectible scale, reinforcing its enduring relevance across cultures and generations.
